Title spare part no. 1: top hinge:: 2: hook of lock:: 3: sticker for front panel black:: 4: front panel black:: 5. Fully compatible usability with UF200/UF190 Series, such as acknowledged Automatic needle alignment function and Full-color touch panel Wafer Probing Machine No.91-1008E SPECIFICATIONS MAIN OPTIONS Test Head Connection Jig（ UF200R only. (Each XY axis A probe area). This is a global marketplace for buyers and sellers of used, surplus or refurbished UF200. If you are looking to buy or sell second hand UF200, please visit EquipMatching.
The following tools are currently being used:
Facilities for Functional Test on Integrated Circuits
288 digital channels (256 providing up to 800Mb/s datarate, 32 providing up to 1.6Gb/s)
4.1GS arbitrary waveform generator
320MS/1GHz digitizer
1x 8 channel device power supply (max 4A/channel)
2x 4 channel device power supply (max 8A/channel)
Additional software for memory test and scan test analysis
Supports manual package test and automatic wafer test (using the UF200 wafer prober)
Accretech UF200 wafer prober
Fully automatic wafer prober for up to 25 wafers/lot
Supports 6inch and 8inch wafers
Temperature controlled chuck, -40°C up to +125°C
256 digital channels (up to 125MHz)
4-channel Agilent power analyser
1 system configured for package test, the other system configured for wafer test
Accretech Tsk Uf200 Uf200sa Uf3000, Find Complete Details about Accretech Tsk Uf200 Uf200sa Uf3000,Wafer Prober from Other Test Instruments Supplier or Manufacturer-csiequipmentsales.com.
Accretech UF200A wafer prober
Standard chuck (not temperature controlled)
Spectral range 7.5 . 14µm
Uploading from safari for mac. Temperature measurement range -40°C . 1200°C
Image size 640x480
Standard lens 1.0/30 mm
Tsk Uf200 Prober
image area (30 x 23)°,
minimum distance 300mm
Microscope objective 1,0x
image (16 x 12) mm²,
distance 50 mm, resolution 25µm
Online: up to 10 points
Offline: temperature of each pixel can be determined, additionally regions with min/max evaluation can be defined
Usage: e.g. detection of hot spots on chips (caused by shorts), thermal check of PCBs, etc
Uf200 Prober Manual Pdf
- Most significant machine model for 300mm wafers
High precision, high rigidity, high throughput machine. - Better cost performance for 300mm wafers.
- 300mm Framed wafer & CSP handling machine.
- It is the prober with high-speed probing that targets non-memory device.
- Most significant machine model for 200mm wafers
High precision, high rigidity machine. - Highly efficient, High throughput, wafer & CSP handling machine.
Better cost performance machine. - High-speed machine for discrete.
- 200mm Framed wafer & CSP handling machine
- Accretech Probing Machine for full wafer testing on a single touch down. Developed with capability to simultaneously measure on 12 stages with dedicate XY stage and POGO tower.
- Consolidated management of the operation of probing machines for higher operation rate.
- This network allows you to consolidate the management of resources with the user host.
- The GEM Network System supports standards based on the SEMI standards to achieve factory automation at customers.
- This is a group of dedicated terminals for increasing the efficiency of test areas.
